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Eightech Tectron is for Vacuum, N2 and Air Reflow Equipment

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Dec. 2017 Renewal the ETC Home Page, and posted the "RNV/RSV Series" of New Vacuum Reflow Equipment and "RN152 Series" of New High-performance N2 Reflow Equipment.
Jun. 2017 In the exhibition, the "JISSO PROTEC 2017" in the Tokyo Big Sight at 7-Jun. to 9-Jun.
Jan. 2017 In the exhibition, the "NEPCON JAPAN 2017" in the Tokyo Big Sight at 18-Jan. to 20-Jan.
Jun. 2016 In the exhibition, the "JISSO PROTEC 2016" in the Tokyo Big Sight at 1-Jun. to 3-Jun.
Jan. 2016 In the exhibition, the "NEPCON JAPAN 2016" in the Tokyo Big Sight at 13-Jan. to 15-Jan.
Jun. 2015 In the exhibition, the "JISSO PROTEC 2015" in the Tokyo Big Sight.
Nov. 2013 In the exhibition, the "productronica 2013" in the Messe Duesseldolf Germany with YKT EUROPE GmbH.
Sep. 2013 ETC has changed the capital. Click here for reference.
Jul. 2013 Renewal the ETC Home Page.
Jun. 2013 In the exhibition, the "JPCA Show 2013" in the Tokyo Big Sight at 5-Jun. to 7-Jun.
Mar. 2013 Introduced the advantage of RN121 series.
Mar. 2013 Introduce the ETC New N2 Reflow Equipment "RN121MW(LL)" on the exhibition report of "Electronic Packaging Technology Mar.2013".
Jan. 2013 In the exhibition, the "NEPCON JAPAN 2013" in the Tokyo Big Sight at 16-Jan. to 18-Jan., ETC exhibited the Vacuum Reflow Equipment "RSV12M-612" for interactive type, "RSV12M-612" for in-line type, "RNVB12M-11" for batch type, New N2 Reflow Equipment "RNV121L-82", Double N2 Reflow Equipment "RNW06M-82", N2 Generator System "EPJ1215". And more ETC exhibited the Flux-free Vacuum Reflow Equipment "RHV12M-212" for Hydrogen type and "RFV12M-212" for Formic Acid type in the "CAR-ELE JAPAN 2013"
NEPCON Japan 2013
(NEPCON JAPAN 2013)
Jun. 2012 In the exhibition, the "JISSO JAPAN 2012" in the Tokyo Big Sight at 13-Jun. to 15-Jun., ETC exhibited the Vacuum Reflow Equipment "RNV12M-512" for in-line type and N2 Reflow Equipment "NJ06SS-52".
Jan. 2012 In the exhibition, the "NEPCON JAPAN 2012" at 18-Jan. to 20-Jan., ETC exhibited the Flux-free Vacuum Reflow Equipment "RNV12M-512" for in-line type, "RNVB12M-11" for batch type, the "IC PACKAGING TECHNOLOGY EXPO 2012", ETC exhibited the High-temperature type of "RSV12M-612", the "LIGHTING JAPAN 2012", ETC exhibited the batch type of "RNVB12M-11".
NEPCON JAPAN 2012
(NEPCON JAPAN 2012)
(Report at 24 Jan. 2012 of CQ Publishing, kumikomi.net) *Open the new page and Japanese only.
Aug. 2011 We exhibited in the NEPCON South China 2011 held from August 30 to September 1.
Jun. 2011 In a exhibition, the JISSO PROTEC 2011, held 1/6 to 3/6, ETC exhibited the batch type of Vacuum N2 Void-less Reflow equipment as trial machine. It has been admired by many visitors and users as same as the In-line type of Vacuum reflow equipment that exhibited in previous NEPCON JAPAN 2011.
JISSO PROTEC 2011
Jan. 2011 In a exhibition, the NEPCON JAPAN 2011, held 19/1 to 21/1, ETC exhibited the In-line type of Vacuum N2 Void-less Reflow equipment.
We have demonstrated the operation of the vacuum reflow equipment and it has been admired that the result of soldering condition done by the equipment with vacuum function was effective in void-less using the X-ray Inspection machine.
NEPCON Japan 2011
(NEPCON JAPAN 2011)
(Internet Exhibition) *Open the new page.
Jun. 2010 In a exhibition, the JISSO PROTEC 2010, ETC exhibited the In-line type of Vacuum N2 Void-less Reflow equipment as trial machine and the NJ08M-82 as Double-Eco type N2 Reflow equipment.
May. 2010 We, ETC, has released new products of N2 Reflow equipment the NC06 series and the NC08 series.
Jan. 2010 In a exhibition, the NEPCON JAPAN 2010, ETC exhibited the NC08-82M as new N2 Reflow equipment and the Vacuum N2 Void-less Reflow equipment as trial machine for next generation of Reflow machine.
Jun. 2009 In a exhibition, the JISSO PROTEC 2009, ETC exhibited.
Jan. 2009 In a exhibition, the NEPCON JAPAN 2009, ETC exhibited.
Jun. 2008 In a exhibition, the JISSO PROTEC 2008, ETC exhibited.
Apr. 2008 An interview of ETC’s president was reported in May issue of the Electronics SMT magazine.
(Articles of the interview on Electronics SMT magazine) *Open the PDF file.(Japanese Version Only)